开来真的,美国大力发展半导体制造了,需要很多人 As of the end of 2023, there are 73 new semiconductor fabrication facilities (fabs) being built or planned for construction around the world: Number of new fabs: 50 of the 73 new fabs are brand new facilities, while the remaining 23 are expansions to existing facilities Location: 42% of the new fabs are being built in the United States Technology: Most of the expansions will focus on producing 28nm technology nodes, but some will focus on more advanced technologies Some of the new fabs in the US include: Chandler, Arizona: Intel is building two new fabs, Fab 52 and Fab 62, at its Ocotillo campus. These fabs are expected to come online in 2024 and cost around $20 billion. Taylor, Texas: Samsung is building a new fab. Clay, New York: Micron Technology is building a new fab. Columbus, Ohio: Intel is building two new fabs. Sherman, Texas: Texas Instruments is building a 300-millimeter semiconductor fabrication plant. shijingshan 发表于 2024-10-03 13:23
定睛一看好几个厂都Intel计划中的。Intel到时还在不在都难说。做fab的收入没design高还要三班倒。我前经理就是从半导体fab转码的。
这个是真的,我们这边team size扩大了一倍,进来的几乎全是印,连俩intern也都是他们的人
芯片也不会自己写代码啊,烧机器跑实验也得有人一个个往上放,堆数据是谁堆啊🤔
底层马工需要的少了,AI写码让有经验的资深员工review一下修修改改就行。
根本没法转。转了EE,也没几个大公司了!
EE转CS容易得多
thanks
这是咋知道的? 我知道CMU本科继续读研的,我也知道PSU本科去CMU读研的,没有人说CMU读研很水,都是功课做不完,每天睡不了几小时。
是说没有身份的国际学生吗?本科国际生没几个,研究生是有一些
Mark
邻居UCB CS 毕业的进了大厂